Do more locally.
Benchmark perception and inference on available accelerators before committing to a custom design. Keep field power and thermal limits central.
Tectivum / SiliconINTELLIGENCE
INTELLIGENCE
AT THE CORE.
AI acceleration, sensor processing and compute modules. A silicon roadmap built around the workloads our machines need to run.
Purpose before processDESIGN THE CHIP
DESIGN THE CHIP
AROUND THE MISSION.
Our first step is to characterize real workloads: perception, sensor fusion, compact models and agent orchestration. Power, memory, latency and reliability set the architecture.
The objective is Tectivum-designed silicon and modules that can move across edge devices and Capacitas compute nodes, with a software toolchain that makes the hardware usable.
- Initial approach
- Commercial silicon + custom modules
- Custom silicon
- Research and design roadmap
- Optimization
- Performance per watt, memory and latency
- Integration
- Sensors, boards and Capacitas nodes
- Fabrication route
- Qualified foundry partners
- Availability
- Development program
Three connected layersFROM PROCESSOR
FROM PROCESSOR
TO PLATFORM.
Build the interface.
Develop carrier boards, memory and I/O integration, secure boot and thermal solutions that turn a processor into a deployable subsystem.
Own the difference.
Identify the workloads where specialized logic can justify the engineering effort. Progress through FPGA validation, foundry evaluation and prototype silicon.
A measured path to siliconBENCHMARK FIRST.
BENCHMARK FIRST.
TAPE OUT WITH EVIDENCE.
Our roadmap starts with an instrumented reference system, advances to Tectivum boards and modules, and then evaluates a custom ASIC or chiplet. Wafer fabrication, package assembly and system manufacturing are separate workstreams.
A dedicated wafer fab is a distinct long-term investment decision. The initial manufacturing focus is product integration, test and repeatable assembly.